Senior Engineer, Advanced Packaging Project Lead

Micron Technology, Inc.

Singapore

On-site

SGD 120,000 - 180,000

Full time

2 days ago
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Job summary

Micron Technology, Inc. is seeking an Engineering Project Management Engineer in Advanced Packaging Technology Development to lead and manage TD and pre-NPI projects, ensuring on-time delivery aligned with the APTD roadmap.

You will coordinate cross-functional teams, manage integrated schedules, identify risks, and hand over projects to internal and external stakeholders with clear documentation in SharePoint and Confluence.

Qualifications

  • 3-5+ years' experience in Semiconductor Frontend/Backend Manufacturing, preferably minimum 1 year of HBM experience.
  • Strong background in Technology Development, Operations Management, or Process Engineering.
  • Solid understanding of advanced packaging flows.
  • Proficiency in Excel, Confluence, Power BI, and Power Apps.

Responsibilities

  • Lead technology development programs and projects to deliver against defined go-to-market timelines.
  • Align program- and project-level plans, dependencies, and deliverables to ensure timely, cohesive execution.
  • Develop and maintain integrated project schedules in collaboration with cross-functional teams.
  • Ensure all deliverables and artifacts meet program requirements and align with established business processes.
  • Proactively identify and resolve risks, issues, and roadblocks, escalating as needed to protect timelines.
  • Facilitate regular project reviews and meetings to track progress and address challenges.
  • Monitor and communicate project status and overall program health to stakeholders.
  • Centralize and manage project documentation and data using SharePoint and Confluence.
  • Continuously improve technology development processes, tools, and systems to drive execution efficiency.
  • Define and execute build plans, priorities, milestones, and schedules with cross-functional stakeholders.
  • Forecast build, material, cost, and resource requirements, maintaining accurate planning data and tools.
  • Optimize build schedules, material preparation, and logistics to align with business priorities and minimize waste and delays.
  • Supervise daily execution, including wafer offloading, kitting, and support of PWF and assembly builds.
  • Identify, mitigate, and elevate risks, issues, and interdependencies to protect timelines and outcomes.
  • Coordinate engineering builds and APTD operations in compliance with established standards and processes.
  • Lead cross-functional improvement initiatives and build strong stakeholder partnerships across programs.

Skills

Project Management
Stakeholder Management
Analytical skills
Leadership
Communication

Education

Bachelor’s or Master’s in Materials/Mechanical/Chemical/Electrical Engineering

Tools

Excel
Confluence
Power BI
Power Apps
SAP
Teamcenter

Job description

Micron Technology, Inc. is seeking an Engineering Project Management Engineer in Advanced Packaging Technology Development to lead and manage TD and pre-NPI projects, ensuring on-time delivery aligned with the APTD roadmap.

You will coordinate cross-functional teams, manage integrated schedules, identify risks, and hand over projects to internal and external stakeholders with clear documentation in SharePoint and Confluence.

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