Senior APTD Project Manager — Advanced Packaging Tech

Micron; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineering Project Management Engineer in Advanced Packaging Technology Development to lead and manage complex TD and pre-NPI projects, ensuring on-time delivery aligned with the technology roadmap.

You will collaborate with internal and external stakeholders, centralize documentation, and drive process improvements across packaging flows, from wafer to assembly, while maintaining project health and meeting quality standards.

Qualifications

• Bachelor’s or master’s degree in engineering field (Materials, Mechanical, Chemical, or Electrical/Electronic).
• 3–5+ years in Semiconductor Frontend/Backend Manufacturing, preferably 1 year HBM experience.
• Experience in Project/Process Integration, Project/Program Management, Technology Development, Operations Management, or Process Engineering.
• Strong analytical and problem-solving capabilities with excellent communication and stakeholder management.

Responsibilities

• Lead technology development programs to meet go-to-market timelines.
• Align program- and project-level plans and deliverables for cohesive execution.
• Develop and maintain integrated project schedules with cross-functional teams.
• Ensure deliverables meet program requirements and processes.
• Identify and mitigate risks and escalate to protect timelines.
• Facilitate regular project reviews and report progress to stakeholders.
• Centralize project documentation using SharePoint and Confluence.
• Drive continuous improvement of development processes and tools.

Skills

Program leadership

Stakeholder management

Analytical skills

Cross-functional

Excel

Power BI

Confluence

Power Apps

Education

Bachelor’s or Master’s in Engineering

Tools

SAP

Teamcenter

Power Apps

Power BI

Excel

Confluence

Job description

Micron Technology, Inc. in Singapore is seeking an Engineering Project Management Engineer in Advanced Packaging Technology Development to lead and manage complex TD and pre-NPI projects, ensuring on-time delivery aligned with the technology roadmap.

You will collaborate with internal and external stakeholders, centralize documentation, and drive process improvements across packaging flows, from wafer to assembly, while maintaining project health and meeting quality standards.