Senior Dry-Etch Lead for NAND Scaling

Micron Technology, Inc.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior technical contributor to lead dry etch modules and advance next‑generation NAND scaling.

You will own critical processes, drive equipment roadmaps with hardware teams, and mentor engineers to strengthen technical leadership. The role requires deep dry etch fundamentals, predictive thinking, and collaboration across multi-functional teams to solve yield, defectivity, and manufacturability challenges.

Qualifications

• PhD or Master’s or Bachelor’s in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
• Advanced dry etch PD experience.
• DOE/SPC/statistics and model-based problem solving.
• Cross-functional leadership and stakeholder communication.

Responsibilities

• Lead development of dry etch technology and essential modules; act as a dry etch area expert.
• Develop/innovate dry etch processes to meet specifications and understand parameter-to-outcome relations.
• Collaborate with hardware teams to map equipment roadmaps for NAND products.
• Lead multi-functional teams to solve structural problems and present development plans.
• Drive RCA, SPC, and corrective actions with suppliers.

Skills

Plasma etch fundamentals

Reactor knowledge

High aspect ratio etch

Cross-functional leadership

Mentorship mindset

Stakeholder communication

Data science basics

Python coding

AI-assisted analysis

Education

PhD or Master’s or Bachelor’s in Electrical/Materials/Chemical Engineering, Physics, or related field

Job description

Micron Technology, Inc. is seeking a senior technical contributor to lead dry etch modules and advance next‑generation NAND scaling.

You will own critical processes, drive equipment roadmaps with hardware teams, and mentor engineers to strengthen technical leadership. The role requires deep dry etch fundamentals, predictive thinking, and collaboration across multi-functional teams to solve yield, defectivity, and manufacturability challenges.