Senior Dry Etch Engineer for Next-Gen NAND

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 140,000 - 230,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an experienced AsaSMTS Dry Etch Engineer to define, develop, and transfer advanced dry etch processes for next‑gen NAND technologies.

You will work with cross‑functional teams, including Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP, to meet program and yield goals. The role emphasizes leadership in process architecture, FOAK development, and robustness through data‑driven problem solving, with opportunities to mentor engineers and contribute

Qualifications

• Proven R&D background in dry etch processes for NAND/DRAM/Logic.
• Experience in translating tech challenges into executable roadmaps.

Responsibilities

• Own key NAND dry etch process levels and modules, guiding roadmaps for N, N+1, N+2 nodes.
• Serve as primary Dry Etch representative in program and module meetings.
• Drive cross-functional execution across Technology Development, Process Integration and Manufacturing.
• Develop and innovate dry etch processes to meet specs for advanced NAND devices.
• Lead FOAK dry etch process development including recipe architecture and integration.
• Establish tool redundancy, run-to-run controls, and monitoring.
• Meet Process maturity, CSPEC, SPC, and quali criteria and timelines.
• Provide clear technical status and risk updates to stakeholders.
• Collaborate with equipment and supplier teams to define hardware roadmaps.
• Apply model-based and data-driven problem solving to resolve yield and defectivity issues.
• Contribute to Technical Leadership Program.

Skills

Leadership

Problem solving

Communication

Data analysis

Project management

Education

PhD in Chemical/Mechanical/Electrical/Material Science/Physics/Ch​emistry/SE

BS/MS in relevant field

Tools

JMP

SAS

Job description

Micron Technology, Inc. in Singapore seeks an experienced AsaSMTS Dry Etch Engineer to define, develop, and transfer advanced dry etch processes for next‑gen NAND technologies.

You will work with cross‑functional teams, including Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP, to meet program and yield goals. The role emphasizes leadership in process architecture, FOAK development, and robustness through data‑driven problem solving, with opportunities to mentor engineers and contribute