Silicon Photonics Packaging Principal Engineer

STATS ChipPAC

Singapore

On-site

SGD 180,000 - 300,000

Full time

14 days+

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Job summary

STATSChipPac in Singapore seeks an experienced R&D Staff Engineer/Principal Engineer specializing in Silicon Photonics advanced packaging to realize next-generation optical interconnects for high-volume manufacturing. You will lead packaging tech development with universities and research institutes, driving Si photonics/chiplet packaging and co-packaged optics toward scalable production.

You will report to the Vice President of R&D and apply advanced packaging technologies, program management,

Qualifications

Advanced packaging and optics fundamentals.
10+ years in semiconductor with 5+ years in technical/project management.
Wafer-level processing and interconnection assembly experience.

Responsibilities

Lead packaging technology development with universities/research institutes.
Define assembly baseline processes and BOM; establish design/manufacturing for performance, reliability, yield and cost.
Collaborate with customers, vendors and research institutes to bring packaging solutions from concept to HVM.
Research and create new technologies for emerging frontiers.
Drive new technologies for timely new product introduction and ramping of new technologies.
Support project management and document technical findings through reports or presentations.