Senior Advanced Packaging Design Engineer (AI-Driven)

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD

Singapore

On-site

SGD 120,000 - 180,000

Full time

3 days ago

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Job summary

ADVANCED MICRO DEVICES (SINGAPORE) PTE LTD is seeking an experienced Package Design Engineer to lead end-to-end substrate and interposer design for 2.5D/3D architectures. The role emphasizes AI-driven design techniques, automation, and fast-paced execution to deliver high-quality results.

You will collaborate with SI/PI, mechanical, and SOC teams, mentor junior engineers, and drive continuous improvement in packaging methodologies while interfacing with OSATs and vendors in a dynamic data

Qualifications

Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field.
Experience in designing complex substrate design or Silicon Bridge or Interposers.
Hands-on experience with AI/ML and automation to improve design productivity and quality.

Responsibilities

Lead end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met.
Handle multiple concurrent design programs in a fast-paced and high-pressure environment.
Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures).
Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams.
Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions.