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A semiconductor company in Singapore is hiring for a role focused on developing and qualifying new packaging technologies. The job includes leading projects, establishing AOI/Metrology processes, and supporting engineering samples. Candidates should have a degree in Engineering and ideally at least 2 years of experience in a semiconductor assembly line. Fresh graduates are also welcome to apply. Competitive compensation and career development opportunities are offered.
Purpose of the Job: To develop and qualify a capable, stable and cost-effective new package (NP), Evolutionary package (EP), New Technology (NT), Emerging Technology (ET) that meets the company’s development roadmap.