Process Associate Engineer — Semiconductor Packaging

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 36,000 - 42,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD.

is seeking a motivated individual to provide technical and administrative support to Process Engineers in the CoW Dept, ensuring total customer satisfaction related to product quality, productivity and cost effectiveness. The role involves troubleshooting line issues across Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure areas, supporting small improvement projects, and acting as a communication channel to production floors while

Qualifications

• Diploma in any Engineering field.
• Ability to work 12 hours rotating shift.
• Fresh graduate is encouraged to apply.

Responsibilities

• Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
• Support small improvement projects assigned by Process Engineer
• Act as communication channels to transmit all messages/information (in particular process change related) to production floor
• Immediate response to analyze products with problem
• Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
• Cross support with others Process Associate Engineer to clear equipment down times

Education

Diploma in Engineering

Job description

STATS ChipPAC MANAGEMENT PTE. LTD.

is seeking a motivated individual to provide technical and administrative support to Process Engineers in the CoW Dept, ensuring total customer satisfaction related to product quality, productivity and cost effectiveness. The role involves troubleshooting line issues across Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure areas, supporting small improvement projects, and acting as a communication channel to production floors while