Advanced Packaging & 3D Integration Engineer
Wanco Manpower Pte Ltd
Turn this role into an interview — a resume and cover letter built around what this employer wants.
Job summary
Wanco Manpower Pte Ltd invites applications for an Advanced Packaging & Process Integration Engineer in Singapore. The role focuses on R&D for advanced semiconductor packaging and heterogeneous integration technologies.
You will contribute to bonding processes and 2.5D/3D integration development in a fast-paced research environment. The ideal candidate holds a relevant engineering degree and 1–6 years of experience in microelectronics, with hands-on flip-chip bonding experience
Qualifications
- Bachelor’s Degree in Engineering or related discipline.
- 1–6 years of relevant experience in microelectronics or semiconductor.
- Experience in advanced packaging / process integration preferred.
- Hands-on experience in flip-chip bonding advantageous.
Responsibilities
- Research and develop fine-pitch flip-chip and hybrid bonding technologies.
- Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes.
- Support interposer and hybrid bond pad fabrication and process integration.
- Optimize bonding materials, surface preparation and process parameters.
- Conduct engineering experiments, process optimization and data analysis.
- Improve process yield, performance and reliability.
- Support 2.5D / 3D heterogeneous integration technology development.
- Collaborate with internal teams and external partners on R&D projects.
Skills
Education
Tools
Job description
Wanco Manpower Pte Ltd invites applications for an Advanced Packaging & Process Integration Engineer in Singapore. The role focuses on R&D for advanced semiconductor packaging and heterogeneous integration technologies.
You will contribute to bonding processes and 2.5D/3D integration development in a fast-paced research environment. The ideal candidate holds a relevant engineering degree and 1–6 years of experience in microelectronics, with hands-on flip-chip bonding experience
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
