Entry-Level Process Engineer – Semiconductor Packaging

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 32,000 - 42,000; Full time

Job summary

STATS CHIPPAC PTE. LTD. is seeking a Service/Process Support role to assist Process Engineers in the CoW Department with attention to product quality, productivity and cost efficiency.

You will troubleshoot line issues across multiple chemical and assembly processes and support small improvement initiatives. The ideal candidate holds a Diploma in Engineering, is comfortable with 12-hour rotating shifts, and is eager to learn Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure

Qualifications

• Diploma in any Engineering field.
• Willingness to study manufacturing processes.

Responsibilities

• Troubleshoot line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure areas.
• Support small improvement projects assigned by Process Engineer.
• Act as communication channel to production floor for process changes and information.
• Respond promptly to analyze products with problems.
• Collaborate with line supervisors to clear bottlenecks affecting cycle time and quality.
• Coordinate with other Process Associate Engineers to reduce equipment downtime.

Skills

Troubleshooting

Communication

Cross-functional collaboration

Education

Diploma in Engineering

Job description

STATS CHIPPAC PTE. LTD. is seeking a Service/Process Support role to assist Process Engineers in the CoW Department with attention to product quality, productivity and cost efficiency.

You will troubleshoot line issues across multiple chemical and assembly processes and support small improvement initiatives. The ideal candidate holds a Diploma in Engineering, is comfortable with 12-hour rotating shifts, and is eager to learn Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure