Advanced Packaging & Process Integration Engineer – Leading R&D Organization

Wanco Manpower Pte Ltd; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Wanco Manpower Pte Ltd invites applications for an Advanced Packaging & Process Integration Engineer in Singapore. The role focuses on R&D for advanced semiconductor packaging and heterogeneous integration technologies.

You will contribute to bonding processes and 2.5D/3D integration development in a fast-paced research environment. The ideal candidate holds a relevant engineering degree and 1–6 years of experience in microelectronics, with hands-on flip-chip bonding experience

Qualifications

• Bachelor’s Degree in Engineering or related discipline.
• 1–6 years of relevant experience in microelectronics or semiconductor.
• Experience in advanced packaging / process integration preferred.
• Hands-on experience in flip-chip bonding advantageous.

Responsibilities

• Research and develop fine-pitch flip-chip and hybrid bonding technologies.
• Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes.
• Support interposer and hybrid bond pad fabrication and process integration.
• Optimize bonding materials, surface preparation and process parameters.
• Conduct engineering experiments, process optimization and data analysis.
• Improve process yield, performance and reliability.
• Support 2.5D / 3D heterogeneous integration technology development.
• Collaborate with internal teams and external partners on R&D projects.

Skills

Analytical skills

Problem-solving

Communication skills

Flip-chip bonding

Data analysis

Education

Bachelor’s Degree in Engineering

Tools

Hybrid bonding equipment

Job description

Our client is a well-established research and technology organisation, focusing on advanced R&D and the development of next-generation semiconductor technologies.

We are looking for an Advanced Packaging & Process Integration Engineer to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.

Position: Advanced Packaging & Process Integration Engineer
Employment Type: Full Time, Permanent
Location: Singapore

Responsibilities:

• Research and develop fine-pitch flip-chip and hybrid bonding technologies
• Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes
• Support interposer and hybrid bond pad fabrication and process integration
• Optimise bonding materials, surface preparation and process parameters
• Conduct engineering experiments, process optimisation and data analysis
• Improve process yield, performance and reliability
• Support 2.5D / 3D heterogeneous integration technology development
• Collaborate with internal teams and external partners on R&D projects

Requirements:

• Bachelor’s Degree in Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering or related discipline
• 1–6 years of relevant experience in microelectronics, semiconductor or component integration
• Experience in advanced packaging / process integration is preferred
• Hands-on experience in flip-chip bonding will be advantageous
• Knowledge of hybrid bonding equipment and materials is advantageous
• Experience in process development, data analysis and DOE preferred
• Good analytical, problem-solving and communication skills