Process & Application Engineer (Die-Bonding / Thermo Compression Bonding / Visual inspection)

EW ELITE SEARCH PTE. LTD.; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

EW ELITE SEARCH PTE. LTD. is seeking a semiconductor packaging engineer in Singapore.

The role covers processing setup for die-attach and thermo-compression, evaluating customer requirements for NPIs, and establishing AOI criteria to detect defects. You will drive yield improvements using DOE/SPC and document SOPs. Candidates should have a degree in engineering and at least two years in packaging, with hands-on experience programming bonding equipment and automated vision/inspection systems,

Qualifications

• Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields.
• Experience: 2+ years in semiconductor packaging or microelectronics assembly.
• Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems.
• Tools: Familiarity with failure analysis and statistical software (Minitab/JMP).

Responsibilities

• Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.
• Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for NPI.
• Quality & Inspection: Set up AOI programs and establish criteria to detect defects (voids, tilt, misalignment).
• Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs.

Skills

Bonding equipment programming

Automated vision systems

DOE/ SPC knowledge

Education

2+ years semiconductor packaging or microelectronics assembly

Degree in Mechanical, Electrical, Materials Engineering

Tools

Minitab/JMP

X-ray failure analysis

Job description

Key Responsibilities

• Process Setup: Program and optimize die-attach, eutectic, and thermo-compression bonding equipment.
• Application Engineering: Evaluate customer requirements, run feasibility studies, and manage sample fabrication for New Product Introduction (NPI).
• Quality & Inspection: Set up Automated Optical Inspection (AOI) programs and establish criteria to detect defects (voids, tilt, misalignment).
• Yield Improvement: Use DOE and SPC to resolve process variations, perform root-cause failure analysis, and write SOPs.

Required Qualifications

• Education: Degree in Mechanical, Electrical, Materials Engineering, or related fields.
• Experience: 2+ years in semiconductor packaging or microelectronics assembly.
• Technical Skills: Hands-on experience programming bonding equipment and automated vision/inspection systems.
• Tools: Familiarity with failure analysis (shear testing, X-ray) and statistical software (Minitab/JMP).