[2868] Process / Application Engineer (Die Bond Tools | Woodlands)

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. in Woodlands North Coast, Singapore, is seeking a technically skilled engineer to lead the design, development, optimization, and validation of software and hardware for advanced die bonding processes.

This on-site role requires collaboration across R&D, software, mechanical, electrical, quality and manufacturing teams to deliver robust packaging solutions. You will analyze customer requirements, perform process optimization, and provide on-site support and

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations (as required).

Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Skills

Troubleshooting

Process optimization

On-site support

Cross-functional collaboration

Education

Bachelor's or Master’s degree in Engineering

Tools

Die bonding equipment

Motion control systems

Process development tools

Job description

Working Location: Woodlands North Coast

Working Days: Monday – Friday

Working Hours: 9:00am -6:00pm

Starting Salary: $3,000 to $6,000

Responsibilities

• Lead thedesign, development, optimization, and validationof software and hardware applications for advanced die bonding processes.


• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing onprocess optimization and application performance.


• Conducttroubleshooting and failure analysisof die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.


• Performmachine setup, calibration, and alignmentto ensure optimal process performance, repeatability, and yield.


• Developtest procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.


• Collaborate withR&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.


• Provideon-site supportfor complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.


• Serve as a key interface betweencustomers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Job Requirement

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).


• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.


• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.


• Experience with semiconductor equipment integration, motion control systems, and process development.


• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.


• Willingness to travel for customer support and on-site installations (as required).