Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) - YZ11

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 89,000 - 112,000; Full time

Job summary

THE SUPREME HR ADVISORY PTE. LTD. is seeking an Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding) to drive customer engagements and packaging development.

The role covers thermo-compression bonding, 2.5D/3D packaging, CoWoS/CoPoS, and chiplet integration at Admirax St in Singapore. Ideal candidates have 5+ years in advanced packaging, hands-on TCB and NPI experience, and strong skills in yield improvement, process qualification, and equipment qualification.

Qualifications

• Minimum 5 years in semiconductor advanced packaging.
• Bachelor's or Master's in a relevant engineering field.
• Hands-on experience in TCB, NPI, process and equipment qualification.

Responsibilities

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.
• Develop and support applications involving TCB, Flip Chip, 2.5D/3D packaging.
• Evaluate bond force, temperature profiles, process windows and alignment.
• Collaborate with cross-functional teams on machine architecture and ROI.

Skills

TCB

Advanced packaging

Flip Chip

NPI

Process Qualification

Equipment Qualification

Manufacturing Eng

Customer Process Dev

Yield Improvement

Reliability Testing

Failure Analysis

Education

Bachelor's or Master's in Materials Engineering

Mechanical/Electrical/Physics/semiconductor engineering

Tools

TCB equipment knowledge

ASMPT knowledge

BESI/Toray/Panasonic tooling

Job description

Position title : Semiconductor Advanced Packaging Application Engineer (Thermo Compression Bonding)

• Location: Admirax St
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary :SGD 8,000 – SGD 10,000/month (Based on experience and technical capability)

Responsibilities:

Customer Application Engineering

• Understand customer packaging roadmaps and manufacturing requirements.
• Translate process requirements into equipment specifications.
• Participate in customer technical discussions and application reviews.
• Support technical sales activities and customer demonstrations.
• Gather customer feedback and recommend future product enhancements.

Advanced Packaging Process Development

- Develop and support applications involving:

• Thermo Compression Bonding (TCB)
• Flip Chip Assembly
• Hybrid Bonding
• HBM Packaging
• CoWoS
• CoPoS
• 2.5D Packaging
• 3D Packaging
• Chiplet Integration
• Large Die Packaging

- Evaluate and optimize:

• Bond force
• Temperature profiles
• Process windows
• Alignment accuracy
• Package warpage
• Yield
• Reliability

Equipment Development

- Work closely with multidisciplinary engineering teams to define:

• Machine architecture
• Functional specifications
• Accuracy requirements
• Throughput targets
• Thermal performance
• Bonding process capability
• Reliability requirements
• Customer acceptance criteria

- Provide technical guidance throughout equipment development.

Machine Qualification

- Serve as the internal customer during equipment development.

- Responsibilities include:

• Defining machine acceptance criteria
• Process qualification
• FAT and SAT support
• Customer buyoff support
• Qualification reporting
• Continuous performance improvement

Technology & Market Intelligence

- Monitor industry developments in:

• Advanced packaging technologies
• Semiconductor manufacturing trends
• Customer requirements
• Competitor equipment
• Emerging packaging architectures

- Support future product strategy and technology roadmap planning.

Requirements:

- Bachelor's or Master's Degree in:

• Materials Engineering
• Mechanical Engineering
• Electrical Engineering
• Chemical Engineering
• Physics
• Semiconductor Engineering
• Related Engineering disciplines

- Minimum5 yearsexperience in semiconductor advanced packaging.

- Hands-on experience in one or more of the following:

• Thermo Compression Bonding (TCB)
• Advanced Packaging Process Development
• Flip Chip Assembly
• New Product Introduction (NPI)
• Process Qualification
• Equipment Qualification
• Manufacturing Engineering
• Customer Process Development

- Experience supporting advanced package technologies such as:

• HBM
• CoWoS
• CoPoS
• Chiplets
• 2.5D Packaging
• 3D Packaging
• Large Die Packaging

- Experience with TCB equipment from ASMPT, BESI, Toray, Panasonic, Kulicke & Soffa or similar suppliers will be an advantage.

- Candidates currently or previously employed by semiconductor manufacturers or advanced packaging companies are strongly encouraged to apply.

- Strong understanding of:

• Thermo Compression Bonding (TCB)
• Semiconductor Packaging
• Flip Chip Assembly
• Process Qualification
• SPC
• DOE
• Yield Improvement
• Reliability Testing
• Failure Analysis
• Package Warpage
• Thermal Management
• Alignment Accuracy
• Semiconductor Manufacturing Processes

- Knowledge of AI accelerator packaging, HBM integration or heterogeneous integration will be highly regarded.