Application/Process Engineer – Die Bond Tools

Recruit Express Pte Ltd; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Recruit Express Pte Ltd in Singapore seeks an experienced engineer to lead design, development, and validation of software and hardware for advanced die bonding processes.

You will translate customer requirements into optimized packaging solutions, troubleshoot tool and process issues, and collaborate with R&D, software, mechanics, and quality teams to implement improvements. On-site support and customer training are essential parts of the role.

Qualifications

• Must have strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer- or panel-level bonding).
• Experience with semiconductor equipment integration and motion control systems.
• Hands-on troubleshooting and problem-solving in high-tech manufacturing or lab settings.
• Excellent written and spoken communication; able to work cross-functionally.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware for die bonding processes.
• Analyze customer requirements into customized packaging solutions with focus on process optimization.
• Troubleshoot die attach tools, process issues, and software anomalies; implement corrective actions.
• Perform machine setup, calibration, and alignment to ensure repeatable performance and yield.
• Develop test procedures, recipes, and documentation for process qualification and validation.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams.
• Provide on-site support for customer applications, including training for field engineers and customers.
• Interface between customers and R&D to relay feedback for tool enhancements.

Skills

Advanced packaging technologies

Equipment integration

Motion control systems

Troubleshooting

Communication & teamwork

Travel readiness

Education

Bachelor's or Master’s degree in Engineering (Mechanical, Electrical, Materials)

Job description

Key Responsibilities:

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions, focusing on process optimization and application performance.
• Conduct troubleshooting and failure analysis of die attach tools, process issues, and software application anomalies; implement corrective actions to enhance tool stability and reliability.
• Perform machine setup, calibration, and alignment to ensure optimal process performance, repeatability, and yield.
• Develop test procedures, application recipes, and documentation for process qualification and validation; maintain detailed logs and technical reports.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address technical challenges and implement design or process improvements.
• Provide on-site support for complex customer applications, including training and coaching for field application engineers and customers to ensure proper tool usage and maximize system capabilities.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements and feature development.

Qualifications:

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Excellent communication and interpersonal skills; ability to work independently and in cross-functional teams.
• Willingness to travel for customer support and on-site installations (as required).

We regret that only shortlisted candidates will be contacted.