TCB Process Engineer

ADAPTIVE TECHNOLOGY SINGAPORE PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

ADAPTIVE TECHNOLOGY SINGAPORE PTE. LTD. seeks a seasoned engineer to lead the development and optimization of Thermal Compression Bonding (TCB) processes for larger yields and production efficiency.

You will collaborate across R&D, Quality, and Production to ensure smooth NPI and continuous improvement, with emphasis on DFMs and DOE-based yield analysis. You will define process flows, tune parameters, and drive CIP actions while maintaining comprehensive process documentation and statistical

Qualifications

• Bachelor's degree or above in Electronics, Mechanical, Automation, Materials Science, Physics, Chemistry or related fields.
• Minimum 3 years' experience in TCB-related equipment and process development in semiconductor packaging.

Responsibilities

• Evaluate and formulate process flows for new TCB products to ensure DFM through functional verification of modules.
• Lead development and debugging of TCB process parameters including temperature, pressure, time, and heating/cooling rates to resolve bottlenecks.
• Drive CIP initiatives for major equipment and product abnormalities by leading FA and issuing improvement reports.
• Collaborate with R&D, Quality, and Production during NPI projects to resolve issues and transition from pilot to mass production.
• Monitor production process stability using statistical metrics (Cpk/Ppk) and adjust parameters based on data analysis.
• Develop and maintain operation documentation including PFDs, SOPs, maintenance specs, inspection standards, OCAP, and EFMEA.

Skills

Process development

DFM (Design for Manufacturability)

DOE (Design of Experiments)

Statistical data analysis

Problem solving under pressure

Communication and teamwork

Education

Bachelor's degree or above in Electronics / Mechanical / Automation / Materials Science / Physics / Chemistry

Tools

ASM Firebird/Adept

Shibaura

K&S Aptura

Datacon

Hanmi

Job description

Job Summary

Lead the development and optimization of Thermal Compression Bonding (TCB) processes to enhance product yield and production efficiency. Collaborate cross-functionally to ensure smooth new product introduction and continuous process improvement in semiconductor packaging.

Responsibilities

• Evaluate and formulate process flows for new TCB products to ensure Design for Manufacturability (DFM) through functional verification of modules


• Lead development and debugging of TCB process parameters including temperature, pressure, time, and heating/cooling rates to resolve bottlenecks such as warpage, coplanarity, and void rate


• Drive Continuous Improvement Plan (CIP) initiatives for major equipment and product abnormalities by leading Failure Analysis (FA) and issuing improvement reports


• Collaborate with R&D, Quality, and Production teams during New Product Introduction (NPI) projects to resolve R&D phase issues and facilitate smooth transition from pilot run to mass production


• Monitor production process stability using statistical metrics (Cpk/Ppk) and adjust parameters proactively based on data analysis


• Develop and maintain operational documentation including Process Flow Diagrams (PFD), Standard Operating Procedures (SOP), equipment operation and maintenance specifications, inspection standards, Out of Control Action Plan (OCAP), and EFMEA

Preferred competencies and qualifications

• Bachelor's degree or above in Electronics, Mechanical Engineering, Automation, Materials Science, Physics, Chemistry, or related fields; Master's degree preferred


• Minimum 3 years' experience in TCB-related equipment and process development in semiconductor packaging; experience in 2.5D/3D advanced packaging and HBM stacking highly preferred


• Familiarity with Thermal Compression Bonding (TCB) or Hybrid Bonding (HB) processes


• Proficiency in operating, debugging, and troubleshooting mainstream TCB/FC equipment such as ASM Firebird/Adept, Shibaura, K&S Aptura, Datacon, Hanmi


• Deep understanding of thermal compression bonding mechanisms; experience with Fluxless bonding, Formic Acid reduction, or Underfill processes highly preferred


• Strong data analysis skills using statistical software like JMP and Minitab for Design of Experiments (DOE) and yield analysis


• Demonstrated quality awareness and hands-on problem-solving ability under pressure, including willingness to work overtime when necessary


• Excellent communication, coordination, and teamwork skills