Research Engineer (Temporary Bonding and Debonding) (APM), IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 60,000 - 80,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore is looking for a Research Engineer specializing in Wafer-to-Wafer Bonding. In this role, you will develop and optimize processes essential for advanced semiconductor packaging, especially with ultra-thin wafers. Candidates should have a Bachelor's degree in relevant fields and experience in TBDB process development is a plus. Strong analytical skills, problem-solving abilities, and teamwork are essential for success in this position.

Qualifications

• Experience in TBDB process development or advanced packaging technologies is an advantage.
• Ability to work in a cleanroom environment and handle precision equipment.

Responsibilities

• Develop and optimize temporary bonding and debonding processes for wafer-level packaging.
• Support integration of process flows for compatibility in advanced packaging.
• Investigate and resolve process issues such as voids, warpage, and delamination.

Skills

Analytical skills

Problem-solving abilities

Good communication

Teamwork

Education

Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering

Job description

Job Description

As a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes—an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development, optimization, and stabilization to enable next-generation packaging technologies.

Key Responsibilities

• Develop and optimize temporary bonding and debonding processes for wafer-level packaging.
• Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding.
• Investigate and resolve process issues and defects such as voids, warpage, and delamination.
• Plan and execute Design of Experiments (DOE) for process development.
• Collect, analyze data, and document findings in technical reports.

Job Requirements

• Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in TBDB process development or advanced packaging technologies is an advantage.
• Strong analytical and problem-solving abilities.
• Good communication and teamwork skills.
• Ability to work in a cleanroom environment and handle precision equipment.