Die Bond Process Engineer - Advanced Semiconductor Packaging

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

Talent Recruitment Pte Ltd in Singapore is seeking an Applications / Process Engineer specializing in Die Bond Tools to join a multidisciplinary team. You will develop, optimize, and validate die bonding processes, set up equipment, and deliver on-site technical support.

The role requires a degree in Mechanical, Electrical, or Materials Engineering and at least three years in semiconductor packaging or die bonding.

Qualifications

• Bachelor's or Master's degree in Mechanical, Electrical, Materials Engineering or related.
• Semiconductor packaging experience is required.
• Minimum 3 years in semiconductor packaging, die bonding equipment or advanced electronics manufacturing.
• Knowledge of Flip Chip, PoP, WLP and PLP is desirable.
• Experience with semiconductor equipment and process development is an asset.

Responsibilities

• Develop, optimize and validate die bonding processes, applications and equipment.
• Set up, calibrate and qualify machines to achieve optimum performance and production yield.
• Troubleshoot equipment and process issues, and implement corrective actions.
• Develop process recipes, test procedures and technical documentation.
• Collaborate with R&D, Software, Mechanical, Electrical, Manufacturing and Quality teams to improve products and processes.
• Provide technical support and installation at customer sites; conduct customer training.

Skills

Semiconductor packaging

Die bonding equipment

Troubleshooting

Communication

Team collaboration

Education

Bachelor's or Master's in Mechanical/Electrical/Materials Engineering

Tools

Motion control systems

Semiconductor equipment

Process development

Job description

Talent Recruitment Pte Ltd in Singapore is seeking an Applications / Process Engineer specializing in Die Bond Tools to join a multidisciplinary team. You will develop, optimize, and validate die bonding processes, set up equipment, and deliver on-site technical support.

The role requires a degree in Mechanical, Electrical, or Materials Engineering and at least three years in semiconductor packaging or die bonding.