Research Engineer, Process Modules, APM, IME

A*STAR - Agency for Science, Technology and Research; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

A*STAR - Agency for Science, Technology and Research in Singapore is seeking a Research Senior Engineer to advance wafer-to-wafer bonding and related semiconductor packaging technologies. You will conduct hands-on process development, wafer characterization, and collaborate across design, integration, materials, and equipment teams to enable next‑generation packaging solutions.

The role focuses on developing and optimizing bonding processes (hybrid and temporary bonding), performing DOE studies,

Qualifications

• Bachelor’s or Master’s degree in materials science, electronics, electrical/mechanical engineering, chemical engineering, physics, or related field.
• Hands-on semiconductor wafer process development, advanced packaging, wafer bonding or cleanroom processes.
• Strong analytical and problem-solving skills.
• Good communication and teamwork skills.
• Ability to work in a cleanroom environment and handle precision equipment.

Responsibilities

• Development and optimization of wafer-to-wafer bonding processes, including hybrid bonding and temporary bonding/debonding.
• Execute process DOE to improve process performance, yield, and reliability.
• Perform wafer inspection and characterization using metrology and failure analysis techniques.
• Investigate process issues and implement corrective actions through systematic data analysis and root‑cause investigation.
• Collaborate with design, process integration, materials, and equipment teams to support R&D projects.
• Prepare short‑loop wafers and support process integration activities for technology development.
• Document process recipes, experimental results and reports while maintaining accurate engineering records.
• Contribute to publication, know‑how and intelligence invention.

Skills

Wafer bonding

Process development

DOE

Metrology & characterization

Analytical thinking

Education

Bachelor’s or Master’s degree in Materials Science/Engineering or related field

Job description

Research Senior Engineer - Wafer-to-Wafer Bonding Engineer (APM)

Advance the Next Generation of Semiconductor Packaging

We are seeking a motivated Wafer-to-Wafer Bonding Engineer to join our multidisciplinary R&D team to support the development of advanced wafer bonding technologies for next-generation semiconductor packaging. This role involves hands‑on process development, wafer characterization, and close collaboration with cross‑functional teams to enable innovative packaging solutions.

Key Responsibilities

• Development and optimization of wafer‑to‑wafer bonding processes, including hybrid bonding and temporary bonding/debonding.
• Execute process DOE to improve process performance, yield, and reliability.
• Perform wafer inspection and characterization using metrology and failure analysis techniques.
• Investigate process issues and implement corrective actions through systematic data analysis and root‑cause investigation.
• Collaborate with design, process integration, materials, and equipment teams to support R&D projects.
• Prepare short‑loop wafers and support process integration activities for technology development.
• Document process recipes, experimental results and reports while maintaining accurate engineering records.
• Contribute to publication, know‑how and intelligence invention.

Qualifications

• Bachelor’s or Masters’ degree in Materials Science, Electronics, Electrical Mechanical, Chemical Engineering, Physics, or a related discipline. Fresh graduates with a passion for semiconductor process development are encouraged to apply.
• Hands‑on experience in semiconductor wafer process development, advanced packaging, wafer bonding, or related cleanroom processes is preferred.
• Strong analytical and problem‑solving skills.
• Good communication and teamwork skills.
• Ability to work in cleanroom environment and handle precision equipment.