Wire Bond Process Engineer

ACCTON TECHNOLOGY SG PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

ACCTON TECHNOLOGY SG PTE. LTD. in Singapore seeks a Wire Bond Process Engineer to develop, qualify, and optimize wire bonding for optical transceiver products.

The role covers process development, equipment optimization, yield improvement, and manufacturing problem resolution across NPI and manufacturing teams. You will work with Die Attach, Active Alignment, Test and Quality teams to analyze bond quality, perform DOE and SPC, create machine recipes, and maintain SOPs and training documentation.

Qualifications

• Bachelor's degree in engineering discipline.
• 5+ years hands-on wire bonding experience.
• Experience in high-volume manufacturing preferred.
• Experience with DOE, SPC, and yield analysis.

Responsibilities

• Develop, qualify, and optimize Wire Bond manufacturing processes.
• Create, validate, and maintain bonding programs and machine recipes.
• Improve manufacturing performance: yield enhancement, process stability, cycle time reduction, defect reduction.
• Perform process characterization and capability studies.
• Analyze bond quality issues and implement corrective actions.
• Support NPI activities, process transfer, and engineering builds.
• Collaborate with Die Attach, Active Alignment, Test, Quality, and Manufacturing teams to improve assembly performance.
• Conduct root cause investigations using structured problem-solving methodologies.
• Support equipment maintenance, calibration, and qualification activities.
• Develop and update SOPs, Work Instructions, process specifications and training documentation.

Skills

Wire bonding fundamentals

Process optimization

Data analysis

DOE/ SPC

Bond parameter optimization

Program creation

Troubleshooting

Education

Bachelor's degree in Mechanical/Electronics/Manufacturing Engineering or related

Tools

K&S (Kulicke & Soffa)

ASM

Other wire bonder equipment

Job description

Position Summary

The Wire Bond Process Engineer is responsible for developing, sustaining, and improving wire bonding processes for optical transceiver products. The role involves equipment optimization, process development, yield improvement, NPI support, and manufacturing problem resolution.

Qualifications

Education

• Bachelor's degree or above in Mechanical Engineering, Electronics Engineering, Manufacturing Engineering, Materials Science, or a related discipline.

Experience

• 5+ years of hands-on wire bonding experience in semiconductor packaging or optoelectronics manufacturing.
• Experience in high-volume manufacturing is preferred.

Technical Skills

• Strong understanding of wire bonding processes and bonding fundamentals.
• Hands-on experience with Wire Bonder platforms such as:
• K&S (Kulicke & Soffa)
• ASM
• or equivalent equipment
• Experience with:
• Bond parameter optimization
• Recipe development
• Bond program creation
• Equipment troubleshooting
• Knowledge of gold, copper, and aluminum wire bonding technologies.
• Familiarity with semiconductor packaging materials and assembly processes.
• Experience with process characterization, SPC, DOE, and yield analysis.
• Understanding of wire pull testing and bond quality inspection methods.

Soft Skills

• Strong analytical and troubleshooting capabilities.
• Good communication and teamwork skills.
• Data-driven decision-making and reporting abilities.

Key Responsibilities

• Develop, qualify, and optimize Wire Bond manufacturing processes.
• Create, validate, and maintain bonding programs and machine recipes.
• Improve manufacturing performance through:
• Yield enhancement
• Process stability improvement
• Cycle time reduction
• Defect reduction
• Perform process characterization and capability studies.
• Analyze bond quality issues and implement corrective actions.
• Support NPI activities, process transfer, and engineering builds.
• Collaborate with Die Attach, Active Alignment, Test, Quality, and Manufacturing teams to improve overall assembly performance.
• Conduct root cause investigations using structured problem-solving methodologies.
• Support equipment maintenance, calibration, and qualification activities.
• Develop and update SOPs, Work Instructions, process specifications, and training documentation.

Monitorkey process indicators and drive continuous improvement initiatives.