Principal / Senior/ Engineer, Package Characterization - APTD

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 80,000 - 100,000; Full time

Job summary

A leading semiconductor company in Singapore seeks an Advanced Packaging Characterization Engineer to provide characterization and failure analysis support. The ideal candidate must have a strong educational background and at least 4 years of experience in semiconductor processes, emphasizing advanced packaging methodologies. Responsibilities include conducting electrical characterization, collaborating with internal teams, and maintaining laboratory standards. The role requires proficiency with several analytical tools and a strong focus on customer needs and continuous improvement.

Qualifications

• 4+ years of experience in the semiconductor process, preferably in R&D or technology development.
• Strong expertise in failure analysis methodologies and techniques.
• Hands-on proficiency with analytical tools and methods.

Responsibilities

• Conduct electrical characterization and provide data analysis.
• Communicate results to internal and external groups.
• Maintain laboratory safety standards and manage equipment.

Skills

Failure analysis methodologies

Electrical characterization

Data analysis

Technical expertise

Communication skills

Education

PhD, Master’s, or Bachelor’s degree in relevant fields

Tools

SEM

FIB

TEM

AFM

FTIR

XPS

X-ray

Job description

Job Description

As an Advanced Packaging Characterization Engineer within Advanced Packaging Technology Development (APTD), your responsibilities include but are not limited to providing package development characterization and failure analysis support for development test vehicles, qualifications, customer returns, new product introduction, and general test failures. You are the domain expert on advanced packaging characterization methodology and is responsible for establishing relevant analysis methods needed to support technology development. You will also have a thorough understanding of the product package assembly and process flow, to work with Process Integration, Process Development, and Product Engineering groups ensuring failures are classified and root cause fixes implemented.

Responsibilities and Tasks

Conduct Electrical Characterization

• Understand PFA techniques available for de-processing failures
• Understand assembly and test process
• Perform electrical verification to confirm failures
• Establish best known method for de-processing package

Provide Data Analysis

• Understand backend test flows, qualification methodologies and be able to pull relevant information

Communicate with Internal/External Groups

• Document failure analysis techniques used to isolate failure for other groups
• Quick, responsive analysis and feedback of PFA results to Product, Process Integration, Reliability, Assembly, RMA, and QRA
• Ensure the PFA lab understands best method to obtain results and ensure lab is ready for analysis of new designs

Provide Technical Expertise

• Conduct TMO training and FA certification
• Serve as technical SME and mentor, contributing to the growth of technical capabilities within the team and fostering a culture of continuous learning.
• Participate actively in technical events such as conferences, workshops and forums to share knowledge and BKM across the network.
• Engage industry experts and vendors on cutting-edge FA tools and techniques required for Advanced Packaging development roadmap.

Maintain Equipment

• Coordinate calibrations (external to Micron)
• Procure parts as needed
• Coordinate host vendors to support equipment repair

Manage Laboratory

• Consistently upholds and promotes Micron’s safety standards, ensuring all activities are conducted in a safe and compliant manner.
• Manage laboratory to comply with TS, ISO14001 and OHSAS requirements.
• To manage the exhaust and scrubber systems of the FA Lab.
• To maintain records and procedures as per Micron GOPs

Education and Experience

• PhD, Master’s, or Bachelor’s degree in Materials Science, Chemical Engineering, Electrical/Electronics Engineering or related discipline.
• 4+ years of experience in the semiconductor process, preferably in R&D or technology development or failure analysis field, with strong expertise in failure analysis methodologies and techniques.
• Hands‑on proficiency with key analytical tools and methods, including: SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, Ion Milling, delayering, and decapsulation techniques.
• Strong communication skills with the ability to collaborate effectively across internal teams and external partners.
• A mindset that emphasizes customer focus, continuous improvement, and striving for excellence.
  Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.