Packaging Process Engineer – 2.5D/3D IC Packaging

ByteDance; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

ByteDance’s Silicon Platform Team serves as the core R&D middleware group for chip development, covering design, packaging, verification, and mass production deployment. The team interfaces with OSATs and fabs, driving process integration across 2D/2.5D/3D packaging technologies.

We seek candidates with a Master’s degree and hands-on experience in packaging, strong problem-solving skills, and a track record of cross-team collaboration to advance cutting-edge chip projects.

Qualifications

• Master's degree or above in Microelectronics, Electronics, Materials Science, Mechanical Engineering, or related fields.
• With at least 2 years of relevant work experience.

Responsibilities

• Process Integration Management: interface between internal teams and OSATs, fabs, and substrate vendors to resolve packaging issues.
• Project Execution & Risk Control: follow up with suppliers to meet process requirements and ensure smooth production flow.
• R&D Pre-research: lead process research and pre-verification of new packaging technologies for advanced projects.
• Cross-team Collaboration: coordinate with packaging design, thermal/stress simulation, and product teams to align constraints.

Skills

Cross-team communication

Problem-solving methodologies

Education

Master's degree or above in Microelectronics/Electronics/Materials Science/Mechanical Engineering

2+ years of relevant packaging experience

Job description

ByteDance’s Silicon Platform Team serves as the core R&D middleware group for chip development, covering design, packaging, verification, and mass production deployment. The team interfaces with OSATs and fabs, driving process integration across 2D/2.5D/3D packaging technologies.

We seek candidates with a Master’s degree and hands-on experience in packaging, strong problem-solving skills, and a track record of cross-team collaboration to advance cutting-edge chip projects.