Technology Development Engineer (Advanced Packaging)

United Microelectronics Corporation (Singapore Branch); Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

United Microelectronics Corporation (Singapore Branch) is seeking an OSAT & Advanced Packaging Engineer to drive advanced packaging with external OSAT partners in Singapore. You will focus on 2.5D/3D packaging platform technologies, develop bumping, underfill, molding and RDL processes, and ensure timely product delivery.

The role requires 2+ years in OSAT R&D/Packaging, a relevant bachelor’s degree, strong English, and hands-on experience with FMEA, DOE, and process verification.

Qualifications

• Bachelor-level engineering degree in Electronics, Electrical, Physics, Materials or related field.
• 2+ years in OSAT R&D / Packaging / Process engineering or related.
• Proficient in English (verbal and written).

Responsibilities

• Work on 2.5D/3D packaging platform technologies.
• Develop bump, underfill, molding and RDL processes.
• Collaborate with internal R&D and OSAT partners to drive heterogeneous integration.
• Perform new advanced packaging process verification and qualification.
• Engage with customers for new product verification.

Skills

2.5D/3DIC process development

Bumping/Molding/Dicing/Bonding

RDL/interconnect technologies

FMEA & DOE

English communication

Education

Bachelor's degree in Electronics / Electrical / Physics / Materials Engineering or related field

Job description

We are looking for a skilled OSAT & AdvancedPackaging Engineer to drive Advanced packaging with external OSAT partners.This role will focus on advanced packaging technologies, ensuring high-quality,cost-effective, and timely product delivery while collaborating withcross-functional team.

Job Responsibilities:

• Work on 2.5D/3D packaging platform technologies.
• Develop bump, underfill, molding and RDL processes.
• Collaborate with internal R&D and OSAT partners to driveHeterogeneous Integration.
• New advanced packaging process verification and qualification.
• Customer engagement and new product verification

Capability

• Knowledge of bumping, molding, dicing, bonding, RDL (RedistributionLayer), and interconnect technologies are plus.
• Experienced in 2.5D and 3DIC process development are plus.
• Skill on FMEA, control plan, DOE (design of experiment) and problemsolving.
• Good communication, self-motived and avid learner

Qualification

• Atleast bachelor degree in electronics/electrical/physics/Materials engineeringor other relevant fields.
• At least 2 years working experience inOSAT R&D/Packaging/Process engineer or other relevant fields.
• ProficientEnglish oral and writing skill.