IC Packaging Engineer – Semiconductor

INTELLIPRO SINGAPORE PTE. LTD.; Singapore; On-site; SGD 47,000 - 71,000; Full time

Benefits offered by this job

Mentorship and training

Career development opportunities

Competitive salary package

Job summary

INTELLIPRO SINGAPORE PTE. LTD. seeks an IC Packaging Engineer to join its semiconductor engineering team.

You will design, develop and optimize IC packaging solutions (wire bonding, flip-chip, WLP, BGA, CSP) to ensure performance, reliability and manufacturability of advanced products. Fresh graduates with strong foundations in microelectronics or materials engineering are welcome. You will collaborate with design, process and test teams, perform thermal, mechanical and electrical analyses, and

Qualifications

• Bachelor’s degree in electrical/electronic engineering, materials science or related field.
• Knowledge of semiconductor packaging technologies and materials.
• Familiarity with EDA tools for packaging design and simulation.
• Strong analytical and problem-solving skills.

Responsibilities

• Design and develop IC packaging solutions (wire bonding, flip-chip, WLP, BGA, CSP).
• Collaborate with design, process, and test engineering teams to ensure package reliability and yield.
• Perform thermal, mechanical, and electrical analysis of packaging designs.
• Support DFM (Design for Manufacturability) and ensure compliance with industry standards.
• Conduct failure analysis and propose improvements to packaging processes.
• Prepare technical documentation and participate in design reviews.

Skills

Analytical skills

Problem solving

Team collaboration

Education

Bachelor’s degree in Electrical/Electronic Engineering, Materials Science, or related discipline

Tools

EDA tools

Job description

About the Role

We are seeking a dedicated IC Packaging Engineer to join our semiconductor engineering team. This role involves developing and optimizing integrated circuit (IC) packaging solutions, ensuring performance, reliability, and manufacturability for advanced semiconductor products. Fresh graduates with strong academic foundations in microelectronics or materials engineering are welcome to apply.

Key Responsibilities

• Design and develop IC packaging solutions (wire bonding, flip-chip, WLP, BGA, CSP, etc.).

• Collaborate with design, process, and test engineering teams to ensure package reliability and yield.

• Perform thermal, mechanical, and electrical analysis of packaging designs.

• Support DFM (Design for Manufacturability) and ensure compliance with industry standards.

• Conduct failure analysis and propose improvements to packaging processes.

• Prepare technical documentation and participate in design reviews.

Requirements

• Bachelor’s Degree in Electrical/Electronic Engineering, Materials Science, or related discipline.

• Knowledge of semiconductor packaging technologies and materials.

• Familiarity with EDA tools for packaging design and simulation is preferred.

• Strong analytical and problem-solving skills.

Added Advantage

• Experience in advanced packaging technologies (e.g., 2.5D/3D IC, TSV, fan-out wafer-level packaging).

• Exposure to semiconductor manufacturing processes and reliability testing.

What We Offer

• Opportunity to work on cutting-edge semiconductor packaging projects.

• Mentorship and training for fresh graduates to build a strong career foundation.

• Competitive salary package and career development opportunities.