Packaging Process Engineer: 2.5D/3D Integration Lead

Pangle; Singapore; Hybrid; SGD 120,000 - 180,000; Full time

Job summary

ByteDance Singapore is seeking a Process Integration Manager to act as the interface between internal teams and OSATs, fabs, and substrate vendors to resolve process-related issues for 2D/2.5D/3D packaging projects.

In this role you will follow up with suppliers to meet process requirements, drive problem-solving, and ensure smooth production flow while leading cross‑team initiatives in packaging design, thermal simulation, and product teams.

Qualifications

• Master's degree or above in Microelectronics, Electronics, Materials Science, Mechanical Engineering, or related fields with at least 2 years of relevant work experience.
• Experience in 2D/2.5D/3D packaging process integration with hands-on experience in FCBGA, FCCSP, MCM, 2.5D, 3D.
• Familiar with packaging process flow and DRM; strong problem-solving and root cause analysis experience.
• Excellent cross-team communication skills.

Responsibilities

• Process Integration Management: interface between internal teams and OSATs, fabs, and substrate vendors to resolve process-related issues for 2D/2.5D/3D packaging projects.
• Project Execution & Risk Control: follow up with suppliers to meet process requirements, intervene in problem-solving, and ensure smooth production flow.
• R&D Pre-research: lead process research for advanced R&D projects and pre-verify new packaging technologies.
• Cross-team Collaboration: coordinate with packaging design, thermal/stress simulation, and product teams to align process constraints.

Skills

Process integration

Cross-team collaboration

Root cause analysis

Problem solving

Packaging knowledge

Education

Master's degree or above in Microelectronics / Electronics / Materials Science / Mechanical Engineering

Tools

DRM

Thermal/stress simulation basics

Job description

ByteDance Singapore is seeking a Process Integration Manager to act as the interface between internal teams and OSATs, fabs, and substrate vendors to resolve process-related issues for 2D/2.5D/3D packaging projects.

In this role you will follow up with suppliers to meet process requirements, drive problem-solving, and ensure smooth production flow while leading cross‑team initiatives in packaging design, thermal simulation, and product teams.