Lead AI-Driven Package Design Engineer

Advanced Micro Devices; Singapore; On-site; SGD 120,000 - 180,000; Full time

Benefits offered by this job

AMD benefits at a glance

Job summary

Advanced Micro Devices in Singapore is seeking an experienced SMTS Package Design Engineer to lead end-to-end substrate and interposer design for 2.5D/3D architectures. You will collaborate with SI/PI, mechanical, and SOC teams to deliver high-quality packaging solutions under tight schedules.

The role requires hands-on experience with complex substrate design, strong ownership, and the ability to apply AI-driven design techniques and automation to increase productivity and design quality in a

Qualifications

• Experience in designing complex substrate, silicon bridges or interposers.
• Ability to execute in multi-project, fast-paced environments.
• Strong collaboration and communication skills.

Responsibilities

• Lead end-to-end package design execution for complex products.
• Drive substrate layouts, bump maps, and interposer designs.
• Collaborate with SI/PI, mechanical, and SOC teams.
• Mentor junior engineers and promote engineering excellence.

Skills

Package design

AI/ML in design

Ownership & accountability

Cross-functional collaboration

Fast-phase execution

Education

Electrical/Computer Eng

Job description

Advanced Micro Devices in Singapore is seeking an experienced SMTS Package Design Engineer to lead end-to-end substrate and interposer design for 2.5D/3D architectures. You will collaborate with SI/PI, mechanical, and SOC teams to deliver high-quality packaging solutions under tight schedules.

The role requires hands-on experience with complex substrate design, strong ownership, and the ability to apply AI-driven design techniques and automation to increase productivity and design quality in a