Packaging Design Engineer

Broadcom Inc.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Broadcom Inc. in Singapore seeks an experienced ASIC package design engineer to lead high‑speed SerDes flip‑chip‑BGA work for AI, networking, HPC and 5G applications. You will own impedance matching, signal/power integrity, manufacturability, reliability and thermal aspects in collaboration with a global team.

The candidate should have 5+ years in flip-chip-BGA package design (or 3+ with M.Eng), strong SI/PI knowledge, and Cadence APD experience is preferred; 2.5D/3DIC exposure is advantageous.

Qualifications

• B.Eng in EE/EEE or M.Eng with relevant years; flip-chip-BGA and high-speed SerDes experience required.
• Experience with package-level SI/PI to apply to package designs.
• Cadence APD (Allegro) experience preferred; other tools considered.

Responsibilities

• Overall design responsibility for ASIC package designs (layout/routing), including impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with experienced package engineering experts
• Package design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.
• Schedule, prioritize, and track work across multiple projects simultaneously
• General flip-chip BGA package design and engineering
• Cooperate with worldwide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

Skills

High-speed SerDes

Signal integrity

Power integrity

Project management

Education

B.Eng (EE/EEE) or equivalent

M.Eng (EE/EEE) or equivalent

Tools

Cadence APD (Allegro Package Designer)

2.5D/3DIC design tools

Job description

You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

Key responsibilities

Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with experienced package engineering experts

Package design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc.

Schedule, prioritize, and track work across multiple projects simultaneously

General flip-chip BGA package design and engineering

Cooperate with worldwide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

About you

B.Eng (EE/EEE) or similar field and 5+ years' experience in flip-chip-BGA package design, including high-speed SerDes, or M.Eng (EE/EEE) or similar field and 3+ years' experience in flip-chip-BGA package design, including high-speed SerDes

Knowledge of package-level signal integrity and power integrity, to apply to package designs

Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered

Good organizational and task management skills to manage multiple package design projects

B.Eng (EE/EEE) or similar field and 8+ years' experience in flip-chip-BGA package design, including high-speed SerDes preferred

M.Eng (EE/EEE) or similar field and 6+ years' experience in flip-chip-BGA package design, including high-speed SerDes preferred

Experience with 2.5D and 3DIC packages is highly advantageous

Unlock job insights

Hirer responsiveness Salary match Number of applicants

Consumer Electronics Manufacturing 101-1,000 employees

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.

Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip and embedded software solutions, Broadcom is changing the world by Connecting everything®.