New Product Introduction Engineer

SILICON BOX; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

Silicon Box is seeking an NPI Engineer to drive new product introduction and ensure smooth transition from development to high-volume manufacturing. You will coordinate cross-functional teams across lithography, wet processing, die prep, PnP, recon, molding, and other backend steps.

You will lead NPI builds, define process flow, qualification plans, and CAPA, while collaborating with R&D, Product Engineering, and Quality to ensure manufacturability and robust processes in a fast-paced,

Qualifications

• Bachelor’s degree in EE, MSE, CHEM, ME, or related field.
• At least 5 years in semiconductor manufacturing, backend/advanced packaging preferred.
• Experience with NPI, process development, or high-mix manufacturing is a plus.

Responsibilities

• Lead and support NPI builds from prototype through mass production.
• Drive process setup, line readiness, and material qualification for new products.
• Collaborate with R&D, Product Eng, and Quality to ensure manufacturability and robustness.
• Develop and review process flow, WIs, FMEA, and control plans for new products.
• Coordinate engineering builds, monitor progress, and resolve issues during NPI phases.
• Support audits and documentation for product qualification.
• Provide technical support for backend processes.
• Troubleshoot excursions, yield issues, and equipment problems.
• Analyze data, SPC trends, and implement CAPA.

Skills

NPI experience

Problem solving

Communication

Automation experience

Education

Bachelor’s degree in Electrical/Materials/CME/Mechanical

Tools

MES systems

Automation equipment

Job description

The NPI Engineer will be responsible for supporting new product introduction (NPI) activities and ensuring smooth transition from development to high-volume manufacturing. This role will work closely with cross-functional teams to establish, qualify, and optimize manufacturing processes across semiconductor operations including lithography, wet processes, die preparation, pick-and-place (PnP), reconstitution (recon), molding, and other backend processes.

Responsibilities

New Product Introduction (NPI)

• Lead and support NPI builds from prototype through engineering and qualification stages to mass production.
• Drive process setup, line readiness, and material qualification for new products.
• Collaborate with R&D, Product Engineering, and Quality teams to ensure manufacturability and process robustness.
• Develop and review process flow, work instructions, FMEA, and control plans for new products.
• Coordinate engineering builds, monitor progress, and resolve technical issues during NPI phases.
• Support customer requirements, audits, and documentation for product qualification.

Process Engineering & Operations Support

• Provide technical support for assigned backend processes
• Troubleshoot process excursions, yield issues, and equipment-related problems.
• Analyze process data, SPC trends, and implement corrective and preventive actions (CAPA).
• Drive continuous improvement initiatives to enhance yield, quality, and cycle time.
• Support production in achieving output, quality, and cost targets.
• Work closely with Equipment, Quality, Production, and Supply Chain teams to ensure seamless operations.
• Interface with suppliers and vendors for material and equipment-related qualifications.
• Participate in design reviews and provide DFM (Design for Manufacturability) feedback.
• Maintain accurate documentation for process specifications, changes, and qualifications.
• Ensure compliance with internal standards, customer requirements, and industry regulations.
• Support audits (internal, customer, and certification audits).

Requirements

• Bachelor’s Degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field.
• At least 5 years of experience in semiconductor manufacturing, preferably in backend/advanced packaging.
• Experience in NPI, process development, or high-mix manufacturing environment is an advantage.
• Familiarity with semiconductor processes such as lithography, wet, die prep, PnP, recon, and molding.
• Strong problem-solving skills with knowledge of root cause analysis tools (e.g., 8D, Fishbone, FMEA).
• Experience with SPC, DOE, and data analysis tools is preferred.
• Good communication and stakeholder management skills.
• Ability to work in a fast-paced, high-volume manufacturing environment.
• Knowledge of advanced packaging technologies (e.g., fan-out, wafer-level packaging).
• Hands-on experience with automation and MES systems.
• Six Sigma / Lean certification is a plus.