A semiconductor manufacturing company in Singapore is looking for a Process Engineer to optimize device qualifications and improve yield performance. Responsibilities include troubleshooting production issues and facilitating training for personnel. The ideal candidate holds a degree in engineering and possesses solid knowledge of process specifications and quality control methodologies. Entry-level candidates are welcome to apply. Join this dynamic team to drive continuous improvement in the manufacturing process.
Qualifications
Experience in semiconductor assembly manufacturing or process engineering is advantageous.
Knowledge of DOE, FMEA, OCAP, Control Plan, WI, and Process Specification.
Entry level candidates are welcome.
Responsibilities
Set-up and optimize new device qualification and engineering lot processing.
Monitor and improve device yield performance.
Investigate and troubleshoot production downtime.
Skills
Knowledge in SPC
Effective communication skills
Ability to multi-task
Education
Diploma / Degree in any Engineering Discipline
Job description
Job Description
Responsible for set-up and optimization of new device qualification, engineering lot processing, process data gathering and reporting.
Monitor and improve device yield performance and process SPC charts.
Investigate and troubleshoot production downtime and quality issues to provide lot disposition on outlier lots.
Perform engineering report and documentation such as 8D, DMAIC, FMEA, CP, Process Specification, Work Instructions, etc.
Implement continuous improvement program (CIP) to support yield and cost improvement, including developing systems for workflow management
Facilitate training of manufacturing personnel on operating procedures and process specification.
Work closely with inter-department to improve process and equipment performance and capability.
Coordinate and communicate with customers for any process engineering related matters.
Setup systems and NPI requirements, handles qualifications and engineering activities.
Requirements
Diploma / Degree in any Engineering Discipline
Working experience in semiconductor assembly manufacturing or process engineering and pre-assembly processes (Backgrind, Laser Marking, Laser Groove, Wafer Dicing) is an advantage.
Knowledge in SPC, DOE, FMEA, OCAP, Control Plan, WI and Process Specification
Clear and effective communication with customers, suppliers and cross department
Able to multi-task and support ad-hoc projects in process and equipment related activities