MTS, Advanced Packaging Integration Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

A leading semiconductor company in Singapore is seeking a Process Integration Engineer to lead initiatives on advanced packaging technologies. The successful candidate should have over 10 years of experience in semiconductor process integration, proficiency in programming for data analytics, and strong problem-solving abilities. Responsibilities include overseeing technology transitions, projecting future capability needs, and ensuring compliance with safety standards. This role is key to the development of innovative packaging solutions, requiring collaboration with cross-functional teams.

Qualifications

• 10+ years of semiconductor process integration experience required.
• Familiarity with data analytics and process modeling expected.
• Strong understanding of process flows and interactions essential.

Responsibilities

• Develop and enable advanced packaging technologies.
• Ensure smooth transition from development to production.
• Monitor industry trends and plan future capabilities.

Skills

Proficiency in Python

Strong data analytics capabilities

Experience with Visual Basic

Education

B.S/M.S./Ph.D. in related fields

Tools

E3

FDC

RMS

Job description

As a Member of Technical Staff (MTS) Process Integration Engineer within APTD, you will lead initiatives focused on developing and enabling advanced packaging technologies for new and emerging integration projects. Your work will ensure that products leveraging these technologies meet performance, cost, manufacturability, quality, reliability, and schedule requirements. This role requires close collaboration with peers, internal partners, and external suppliers to coordinate development and successful deployment of next-generation packaging solutions.

Key Responsibilities

Technology Development & Integration

• Develop and enable advanced packaging technologies that deliver cost-effective solutions with predictable reliability.
• Collaborate with peers to establish project timelines and verify work needed to meet objectives.
• Partner with internal teams and external suppliers to develop new capabilities required for advanced packaging solutions.

Product Transition & Qualification

• Ensure smooth transition from new product development and qualification to small-volume and high-volume production.
• Provide proper Plan of Record (POR) documentation for product transfer to manufacturing.
• Work with internal teams to support new product and technology transfers.

Future Capability Planning

• Anticipate packaging needs and develop capabilities ahead of demand.
• Monitor industry trends and define future roadmaps for packaging technologies.
• Collaborate with peers and internal teams to implement new capabilities aligned with strategic goals.

Management & Communication

• Identify areas for improvement and propose systematic solutions.
• Adapt communication style to engage and motivate teams effectively.
• Fulfill formal communication and coordination responsibilities across work units.
• Maintain frequent communication with peers and team members under your guidance.
• Continuously develop knowledge and skills to meet organizational needs.

Safety & Compliance

• Promote and enforce safe, compliant behavior through regular communication and performance management.
• Review and respond to reports from supervisory staff, EHSS teams, and auditors.
• Conduct work area inspections and operational observations.
• Maintain area procedures and training to ensure legal compliance and adherence to management systems.

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, Material, or other related technical fields
• 10+ years of semiconductor process integration experience, preferably with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
• Experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and ability to integrate semiconductors while partnering with process and product engineering team
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Consistent track record to solve problems and address root causes