Memory Packaging Pathfinding Architect

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 180,000 - 320,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging strategies.

You will bridge silicon, package, board, and system factors, guiding long‑term technology direction and partnering with customers to turn ideas into scalable products. You will lead cross‑stack optimization across memory architectures, work with design teams and customers for edge‑AI and data‑center memory solutions, and influence industry standards.

Qualifications

• Master’s degree or equivalent degree and industry experience in EE, CE, CS, or related field.
• At least 5 years of relevant industry experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Extensive hands-on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including but not limited to Cadence, Siemens and Ansys tools.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next-generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with package centric solutions approach.
• Drive long-term memory technology packaging strategy and influence industry standards.
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency. Develop measurement automation for incoming substrate materials.

Skills

Memory timing

End-to-end memory architectures

Signal integrity

Power integrity

Data analysis (Python/JMP/MATLAB)

AI/LLMs for engineering

Cross-functional collaboration

Project leadership

Education

Master’s degree or equivalent in EE/CE/CS

PhD (preferred)

Tools

Ansys

Siemens

Cadence

Job description

Micron Technology, Inc. in Singapore is seeking a Package Pathfinding Architect to define next-generation memory packaging strategies.

You will bridge silicon, package, board, and system factors, guiding long‑term technology direction and partnering with customers to turn ideas into scalable products. You will lead cross‑stack optimization across memory architectures, work with design teams and customers for edge‑AI and data‑center memory solutions, and influence industry standards.