Lead Memory Packaging Pathfinding Architect

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior Package Pathfinding Architect to guide next‑generation memory packaging architectures from datacenter to edge‑AI.

Lead cross‑stack optimization across silicon, package, board, and system with a focus on speed, bandwidth, and power efficiency. You will partner with customers and internal teams to shape long‑term packaging roadmaps and influence industry standards, while leveraging AI-driven EDA tools to improve design cycles and substrate material

Qualifications

• Master’s degree in EE/CE/CS or related field with relevant industry experience.
• At least 5 years of experience in package design, electrical simulations and tools like Ansys, Siemens and Cadence.
• Deep understanding of memory timing, signaling, power, package process technology.
• Experience applying AI or LLMs for engineering efficiency.

Responsibilities

• Define next-generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross-stack co-optimization across silicon, package, board, and system with package centric solutions approach.
• Drive long-term memory technology packaging strategy and influence industry standards.
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge-AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based EDA and internal automation tool sets for enhancing design cycle efficiency.
• Develop measurement automation for incoming substrate materials.

Skills

Memory timing analysis

Memory package design

Signal and power integrity

Data analysis tools (Python, MATLAB, J

Education

Master’s degree in EE/CE/CS or related field

PhD in a related technical field

Tools

Cadence

Siemens

Ansys

Job description

Micron Technology, Inc. is seeking a senior Package Pathfinding Architect to guide next‑generation memory packaging architectures from datacenter to edge‑AI.

Lead cross‑stack optimization across silicon, package, board, and system with a focus on speed, bandwidth, and power efficiency. You will partner with customers and internal teams to shape long‑term packaging roadmaps and influence industry standards, while leveraging AI-driven EDA tools to improve design cycles and substrate material