HBM Packaging Engineer — AI-Driven Innovation

Micron Technology; Singapore; On-site; SGD 70,000 - 90,000; Full time

Job summary

Micron Technology in Singapore is seeking an Engineer to join the Package Development Engineering Team for Advanced Packaging. You will contribute to transitioning new products from development to high-volume manufacturing, partnering with Development and Manufacturing teams.

The role emphasizes AI-enabled tooling usage, data-driven analysis, and close collaboration across levels to drive efficiency and reliability in next-generation memory packaging technologies.

Qualifications

• Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline.
• Operations support, including shift and weekend coverage, is required.
• Strong analytical, logical, and critical thinking skills
• Effective communicator, able to collaborate across all levels
• Growth mindset with a passion for continuous learning
• Internship or experience in the semiconductor industry is a plus
• Demonstrated leadership and a track record of impact are highly desirable
• Interest in and knowledge of the semiconductor industry and Micron is preferred
• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Responsibilities

• Integrate AI-assisted tool and insights into daily work to improve efficiency, quality or effectiveness.
• Contribute to a culture of continuous improvement by identifying, testing and sharing AI-enabled enhancement within one scope of work.
• Apply engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
• Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments Failure Mode & Effect Analysis (FMEA) and implement effective control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high‑volume manufacturing.

Skills

Analytical thinking

Effective communicator

Growth mindset

Leadership

Collaboration

AI literacy

Education

Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline

Tools

JMP

Python

MES systems

Automation

Job description

Micron Technology in Singapore is seeking an Engineer to join the Package Development Engineering Team for Advanced Packaging. You will contribute to transitioning new products from development to high-volume manufacturing, partnering with Development and Manufacturing teams.

The role emphasizes AI-enabled tooling usage, data-driven analysis, and close collaboration across levels to drive efficiency and reliability in next-generation memory packaging technologies.