Tech Lead, Package Development for Next-Gen Memory AI
1100 Micron SemiAsiaOP Pte Ltd
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Job summary
Micron Technology, Inc. in Singapore seeks a Member of Technical Staff to define and drive chip-package interaction (CPI) technology strategy, enabling next-generation memory product transitions through robust design and risk mitigation.
This high-impact role operates across Fab Process Integration, Product Development, Package Design, and Assembly Technology Development, with a focus on AI-driven workflows and collaboration with global teams to deliver innovative memory solutions.
Responsibilities
Job description
Micron Technology, Inc. in Singapore seeks a Member of Technical Staff to define and drive chip-package interaction (CPI) technology strategy, enabling next-generation memory product transitions through robust design and risk mitigation.
This high-impact role operates across Fab Process Integration, Product Development, Package Design, and Assembly Technology Development, with a focus on AI-driven workflows and collaboration with global teams to deliver innovative memory solutions.
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