Lead Process Integration Engineer, 3D NAND & AI Innovation

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks a senior Wafer Process Development lead to drive the development and operation of 3D NAND semiconductor modules, integrating deep expertise in materials, lithography, and device physics.

You will define structural specifications, set strategic direction, coordinate cross-functional teams, and drive manufacturability improvements from R&D to production.

Qualifications

• Requires 5+ years of wafer fabrication process development experience.
• Masters/PhD in a relevant engineering field required.
• Strong knowledge of NAND process flows and reliability issues.

Responsibilities

• Lead one or more 3D NAND module development projects from design to production.
• Define structural specifications and process requirements for assigned modules.
• Set strategic direction and a plan for continual improvement.
• Identify and address structure, electrical, and reliability issues via model-based control.
• Coordinate cross-functional teams to enable rapid project progression.
• Transfer new technology from R&D to high-volume manufacturing.

Skills

Data analysis

Problem solving

Process optimization

Cross-functional collaboration

NAND technology knowledge

Education

Master's or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science

Tools

Python

Tableau

Power BI

SolidWorks

Job description

Micron Technology, Inc. in Singapore seeks a senior Wafer Process Development lead to drive the development and operation of 3D NAND semiconductor modules, integrating deep expertise in materials, lithography, and device physics.

You will define structural specifications, set strategic direction, coordinate cross-functional teams, and drive manufacturability improvements from R&D to production.