Lead 3D NAND Process Integration Engineer

Micron Technology, Inc; Singapore; Hybrid; SGD 180,000 - 260,000; Full time

Job summary

Micron Technology, Inc in Singapore is seeking a Principal Engineer for 3D NAND process integration to drive the technology roadmap and pathfinding in advanced memory. The role sits in a cutting-edge R&D environment, leveraging AI-enabled data analytics to accelerate learning cycles and solve scaling challenges for future memory nodes.

You will lead end-to-end development from concept to validation, collaborate with Device, Probe, Test, Design and Operations teams, and push innovations through

Qualifications

• Strong foundation in semiconductor device physics and process integration.
• Experience in memory (NAND/DRAM), CMOS/logic, or emerging/embedded memory technologies.
• Proven ability in experiment design, data analysis, and problem-solving.
• Ability to work across cross-functional R&D teams.
• Strong communication and collaboration skills.
• Demonstrated innovation mindset, with exposure to advanced data analytics or AI/ML techniques a plus.

Responsibilities

• Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement.
• Lead end-to-end development (conception → technology validation) including learning vehicles, characterization, and debug.
• Solve complex integration challenges using data-driven, AI-assisted, and model-based approaches, identifying critical technology gaps and enabling solutions.
• Define and optimize module/process architecture (electrical targets, process flows, design rules) to meet product requirements.
• Collaborate across the full ecosystem (Device, Probe, Test, Design, Operations) to drive performance, yield learning, and execution.
• Drive technical innovation through process improvements, patents, and publications while building strong global networks.

Skills

Semiconductor device physics

Process integration

Memory technologies

Experiment design

Data analysis

Cross-functional collaboration

AI/ML exposure

Communication skills

Education

MS or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering

Job description

Micron Technology, Inc in Singapore is seeking a Principal Engineer for 3D NAND process integration to drive the technology roadmap and pathfinding in advanced memory. The role sits in a cutting-edge R&D environment, leveraging AI-enabled data analytics to accelerate learning cycles and solve scaling challenges for future memory nodes.

You will lead end-to-end development from concept to validation, collaborate with Device, Probe, Test, Design and Operations teams, and push innovations through