Lead 3D NAND Process Integration Engineer (AI-Driven)

Micron Technology

Singapore

On-site

SGD 120,000 - 180,000

Full time

4 days ago
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Job summary

Micron Technology, Inc. in Singapore is seeking a senior researcher to drive the Advanced NAND Technology roadmap, bridging device concepts, materials, and process integration into manufacturable solutions.

You will apply AI-enabled data analytics and model-driven methods to accelerate learning cycles and tackle scaling challenges in next-generation memory nodes. You will lead end-to-end development from concept through technology validation, collaborating with Device, Probe, Test, Design, and

Qualifications

  • Strong foundation in semiconductor device physics and process integration.
  • Experience in memory technologies (NAND/DRAM) or CMOS/logic.
  • Ability to design experiments, analyze data and solve problems.
  • Ability to collaborate across cross-functional R&D teams.
  • Excellent communication and collaboration skills.
  • Innovation mindset with exposure to data analytics or AI/ML is a plus.

Responsibilities

  • Drive 3D NAND integration and technology roadmap, leading pathfinding and architecture enablement.
  • Lead end-to-end development from concept to validation, including learning vehicles and debug.
  • Use data-driven, AI-assisted, and model-based approaches to solve integration challenges.
  • Define and optimize module/process architecture to meet product requirements.
  • Collaborate across Device, Probe, Test, Design, and Operations to improve performance and yield.
  • Drive technical innovation through process improvements, patents, and publications.

Skills

Semiconductor physics
Memory technologies
Experiment design
Cross-functional teamwork
Communication skills
AI/ML data analytics exposure

Education

MS or PhD in Electrical Engineering / Materials Science / Physics / Chemical Engineering

Job description

Micron Technology, Inc. in Singapore is seeking a senior researcher to drive the Advanced NAND Technology roadmap, bridging device concepts, materials, and process integration into manufacturable solutions.

You will apply AI-enabled data analytics and model-driven methods to accelerate learning cycles and tackle scaling challenges in next-generation memory nodes. You will lead end-to-end development from concept through technology validation, collaborating with Device, Probe, Test, Design, and

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