Lead Process Integration Engineer, 3D NAND

Micron

Singapore

On-site

SGD 150,000 - 190,000

Full time

6 days ago

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Job summary

Micron Technology, Inc. is seeking a Principal/Staff Engineer, Process Integration for NTI NAND in Singapore. You will lead module development for 3D NAND, define specifications, set strategic direction, and proactively resolve issues using model-based methods.

You’ll coordinate a cross-functional team and drive IP generation while transferring technology to manufacturing. The role requires advanced education in electrical-related fields, 5+ years in wafer fabrication/process development, and

Qualifications

Minimum of 5 years of experience in Wafer Fabrication Process Development in Dry Etch, Photolithography, Films, Wet Process, CMP or Process Integration.
In-depth knowledge of PI modules on new NAND technologies and related structural & electrical fail mechanisms.
Experience in R&D and technology transfer to manufacturing.
Committed to quality, collaboration, and continuous improvement.

Responsibilities

Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits.
Specification Definition: Define structural specifications and process requirements for assigned modules.
Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan.
Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control.
Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control.