HBM Reliability & Test Engineering Lead

Micron Technology, Inc.

Singapore

On-site

SGD 180,000 - 280,000

Full time

8 days ago

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Job summary

Micron Technology, Inc. seeks a high-impact leader for the High Bandwidth Memory Product Engineering Media Health team in Singapore.

You will drive reliability test development and lead a cross-functional effort to reduce DPM and improve yield, quality, and cycle time across DRAM and interface die products. You will mentor engineers, manage complex qualification plans, and collaborate with Fab, TD, GQ, and System teams to deliver robust reliability solutions and cost-effective manufacturing

Qualifications

Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
Experience in semiconductor devices, circuit design, or product validation is a plus.
Familiarity with CMOS technology, DRAM architecture, and basic device physics.
Exposure to data analysis, statistics, and scripting tools such as Python or JMP.

Responsibilities

Reliability test flow development for product reliability aspects.
Qualification plan definition and progress management with Global Quality.
Drive extrinsic and intrinsic reliability improvements via optimized test flows and strategy.
Root cause analysis and resolution of Qual and RMA device issues with cross-functional teams.
Cross-functional collaboration with Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability teams.