HBM Product Engineering Lead — Reliability & Test Strategy

Micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking a senior engineer to lead a High Bandwidth Memory (HBM) reliability team, driving both intrinsic and extrinsic test development and the manufacturing test flow to meet KPI targets for quality, cost and cycle time.

You will mentor engineers, collaborate with Fab, TD, GQ and Quality/Reliability teams, perform root-cause analysis, and push process conversions to improve yield, DPM reductions, and overall product reliability for the latest HBM products.

Qualifications

• Experience in reliability test development and execution.
• Strong understanding of CMOS DRAM technologies and device physics.
• Proven ability to analyze data and drive root-cause resolution.

Responsibilities

• Develop reliability test flows and plans for product reliability.
• Lead qualification, gating, and issue resolution with quality teams.
• Drive extrinsic and intrinsic reliability improvements and DPM reduction.
• Collaborate with fab, TD, GQ, and quality teams across functions.

Skills

Reliability testing

CMOS tech

DRAM architecture

Data analysis

Python scripting

Root cause analysis

Cross-functional

Team leadership

Problem solving

Quality focus

Education

Bachelor’s or Master’s degree in Electrical and Electronics Engineering

Tools

Python

JMP

Job description

Micron Technology, Inc. in Singapore is seeking a senior engineer to lead a High Bandwidth Memory (HBM) reliability team, driving both intrinsic and extrinsic test development and the manufacturing test flow to meet KPI targets for quality, cost and cycle time.

You will mentor engineers, collaborate with Fab, TD, GQ and Quality/Reliability teams, perform root-cause analysis, and push process conversions to improve yield, DPM reductions, and overall product reliability for the latest HBM products.