HBM Product Engineering Lead — Innovation & Yield

Micron; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Singapore seeks a senior leader in HBM Product Engineering to build and mentor a high-performance team focused on DRAM and stacked die HBM products. You will own test coverage, validation, and yield improvements while collaborating with Fab, Design, and Technology Development to ensure reliability and cost efficiency.

The role emphasizes leadership, cross-functional collaboration, and project management to accelerate manufacturing scale and product readiness.

Qualifications

• Bachelor's or Master's degree in Electrical & Electronics Engineering.
• Strong leadership and technical problem-solving skills with deep circuit analysis experience.
• Solid knowledge of statistics, data analysis tools, and scripting.

Responsibilities

• Optimize test coverage on current and future HBM architectures and process nodes to ensure efficient high-volume manufacturing.
• Develop, validate, characterize, and qualify Micron's next-generation HBM products for reliability and market readiness.
• Support design verification and in-depth circuit analysis using CAD tools and Verilog simulations.

Skills

Leadership

Problem solving

Statistics & data analysis

Scripting

Cross-functional collaboration

Adaptability

Accountability

Education

Bachelor/Master in Electrical & Electronics Engineering

Tools

CAD tools

Verilog

Job description

Micron Singapore seeks a senior leader in HBM Product Engineering to build and mentor a high-performance team focused on DRAM and stacked die HBM products. You will own test coverage, validation, and yield improvements while collaborating with Fab, Design, and Technology Development to ensure reliability and cost efficiency.

The role emphasizes leadership, cross-functional collaboration, and project management to accelerate manufacturing scale and product readiness.