HBM Packaging Engineer for NPI & Scale-Up

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 50,000 - 70,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking Engineers for the Package Development Engineering Team in Singapore, focusing on advanced packaging technologies. This role supports the transition of new products to high-volume manufacturing.

Applicants should hold a related Bachelor's degree and possess strong analytical and communication skills, with a passion for continuous learning. Familiarity with the semiconductor industry and AI tools is preferred, offering a collaborative environment for innovation.

Qualifications

• Bachelor’s degree or higher in relevant engineering disciplines.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across all levels.
• Leadership experience and an interest in the semiconductor industry.

Responsibilities

• Integrate AI-assisted tools into daily work to improve efficiency.
• Contribute to a culture of continuous improvement and testing enhancements.
• Partner with teams to support Low Volume Manufacturing and Run at Risk.
• Perform risk assessments and implement control plans.

Skills

Analytical skills

Critical thinking

Effective communication

Team collaboration

Education

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering

Job description

1100 Micron SemiAsiaOP Pte Ltd is seeking Engineers for the Package Development Engineering Team in Singapore, focusing on advanced packaging technologies. This role supports the transition of new products to high-volume manufacturing.

Applicants should hold a related Bachelor's degree and possess strong analytical and communication skills, with a passion for continuous learning. Familiarity with the semiconductor industry and AI tools is preferred, offering a collaborative environment for innovation.