HBM Packaging Engineer – NPI & High-Speed Memory

Micron Technology, Inc; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.

Qualifications

• Bachelor’s degree or higher in a related discipline.
• Experience in the semiconductor industry preferred.
• Ability to apply AI-enabled tools effectively.

Responsibilities

• Support technology transfer from development to manufacturing.
• Perform risk assessments and implement corrective actions.
• Integrate AI-assisted tools to improve efficiency.

Skills

Strong analytical skills

Effective communication

Growth mindset

Leadership

Education

Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, or Mechanical Engineering

Tools

Python

JMP

Job description

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.