HBM Engineer: AI-Driven Memory Innovation

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks engineers to integrate AI-enabled tools into daily workflows, improving efficiency and quality across semiconductor packaging and manufacturing processes.

The role focuses on applying DOE, SPC, and data analytics to accelerate learning cycles, collaborate across development and production teams, and ensure smooth tech transfer to high-volume manufacturing while upholding Micron’s core values.

Qualifications

• Bachelor’s degree or higher in engineering disciplines.
• 2+ years in semiconductor field.
• Experience in fan-in packaging / advanced packaging technology.
• Experience with SPC, DOE & JMP.
• Ability to work shifts and weekends.
• AI literacy to use AI-enabled tools responsibly.

Responsibilities

• Integrate AI-assisted tools into daily work to improve efficiency.
• Identify, test and share AI-enabled enhancements.
• Apply engineering and statistics to accelerate learning cycles (DOE) for product qualifications.
• Collaborate with AP TD and manufacturing teams to support LVM and RAR.
• Perform FMEA and implement corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Skills

Analytical thinking

Critical thinking

Communication

Leadership

AI literacy

Education

B.S./M.S. in Engineering

Tools

JMP

Python

SPC

DOE

Job description

Micron Technology, Inc. in Singapore seeks engineers to integrate AI-enabled tools into daily workflows, improving efficiency and quality across semiconductor packaging and manufacturing processes.

The role focuses on applying DOE, SPC, and data analytics to accelerate learning cycles, collaborate across development and production teams, and ensure smooth tech transfer to high-volume manufacturing while upholding Micron’s core values.