HBM Packaging Product Engineer: Yield & AI/ML Innovator

Micron Technology; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Singapore is seeking a member of the HIG HBM Package Product Engineering team to drive yield, cost and cycle time improvements across HBM products. You will collaborate with Fab, Technology Development, Packaging and Quality teams to deliver end-to-end improvements in the manufacturing flow.

The role requires a degree in Electrical/Electronic/Mechanical Engineering with 3+ years in semiconductors, strong problem solving, data analysis skills, and willingness to travel

Qualifications

• Bachelor's or Master's degree in Electrical, Electronic, or Mechanical Engineering with 3+ years in semiconductors.
• Strong problem solving with root-cause analysis.
• Experience with statistics and data analysis tools; scripting.
• Willingness to work on site in Singapore with international travel.

Responsibilities

• Improve ASM yield and DPM in assembly flows to reduce inline fallout.
• Improve HBM Cube yield through test optimization and coverage improvements.
• Lead cross-functional initiatives to enhance cumulative yield and quality.
• Debug and resolve Qual and RMA packaging issues via EFA/PFA analysis.
• Drive process conversions with FAB, TD, and Packaging to boost yield and cost efficiency.
• Collaborate with Fab, TD, Design, System Development, and QA for end-to-end product shipping.
• Promote innovation and drive improvements for competitive advantage.
• Develop project management skills within the team for timely delivery.
• Participate in AI/ML model development to enhance KPIs like quality and cycle time.
• Lead technical decisions on risk analysis and project prioritization.

Skills

Electrical Engineering

Mechanical Engineering

Problem solving

Data analysis

Statistics

Scripting

Leadership

Communication

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Tools

Circuit analysis

Job description

Micron Technology, Singapore is seeking a member of the HIG HBM Package Product Engineering team to drive yield, cost and cycle time improvements across HBM products. You will collaborate with Fab, Technology Development, Packaging and Quality teams to deliver end-to-end improvements in the manufacturing flow.

The role requires a degree in Electrical/Electronic/Mechanical Engineering with 3+ years in semiconductors, strong problem solving, data analysis skills, and willingness to travel