Senior / Process Associate Engineer

STATS CHIPPAC PTE. LTD.; Singapore; On-site; SGD 32,000 - 42,000; Full time

Job summary

STATS CHIPPAC PTE. LTD. is seeking a Service/Process Support role to assist Process Engineers in the CoW Department with attention to product quality, productivity and cost efficiency.

You will troubleshoot line issues across multiple chemical and assembly processes and support small improvement initiatives. The ideal candidate holds a Diploma in Engineering, is comfortable with 12-hour rotating shifts, and is eager to learn Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure

Qualifications

• Diploma in any Engineering field.
• Willingness to study manufacturing processes.

Responsibilities

• Troubleshoot line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure areas.
• Support small improvement projects assigned by Process Engineer.
• Act as communication channel to production floor for process changes and information.
• Respond promptly to analyze products with problems.
• Collaborate with line supervisors to clear bottlenecks affecting cycle time and quality.
• Coordinate with other Process Associate Engineers to reduce equipment downtime.

Skills

Troubleshooting

Communication

Cross-functional collaboration

Education

Diploma in Engineering

Job description

About us

ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

To provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.

Key responsibilities

• Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
• Support small improvement projects assigned by Process Engineer
• Act as communication channels to transmit all messages/information (in particular process change related) to production floor
• Immediate response to analyze products with problem
• Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
• Cross support with others Process Associate Engineer to clear equipment down times

What we're looking for

• Diploma in any Engineering field
• Ability to work 12 hours rotating shift
• Positive mindset and ability to adapt to fast-paced working environment
• Willingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure
• Fresh graduate is encouraged to apply