Senior / Process Associate Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 36,000 - 42,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD.

is seeking a motivated individual to provide technical and administrative support to Process Engineers in the CoW Dept, ensuring total customer satisfaction related to product quality, productivity and cost effectiveness. The role involves troubleshooting line issues across Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure areas, supporting small improvement projects, and acting as a communication channel to production floors while

Qualifications

• Diploma in any Engineering field.
• Ability to work 12 hours rotating shift.
• Fresh graduate is encouraged to apply.

Responsibilities

• Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
• Support small improvement projects assigned by Process Engineer
• Act as communication channels to transmit all messages/information (in particular process change related) to production floor
• Immediate response to analyze products with problem
• Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
• Cross support with others Process Associate Engineer to clear equipment down times

Education

Diploma in Engineering

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

To provide technical and administrative support to Process Engineers in CoW Dept to ensure total customer satisfaction related to product quality, productivity and cost effectiveness.

Key responsibilities

• Troubleshooting line issues in Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure area
• Support small improvement projects assigned by Process Engineer
• Act as communication channels to transmit all messages/information (in particular process change related) to production floor
• Immediate response to analyze products with problem
• Cross support with line supervisor to clear real time bottleneck that impact cycle time and quality
• Cross support with others Process Associate Engineer to clear equipment down times

What we're looking for

• Diploma in any Engineering field
• Ability to work 12 hours rotating shift
• Positive mindset and ability to adapt to fast-paced working environment
• Willingness to study the process of Flip Chip Attach, Reflow, Wafer Clean, Plasma, Underfill and Oven Cure
• Fresh graduate is encouraged to apply