Senior Process Engineer – Package Pick & Place Excellence

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 66,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a technically skilled Associate Engineer to provide support to Process Engineers in the eWLB Backend2 Department. You will help ensure product quality, productivity, and cost efficiency while sustaining production lines.

You will characterize new devices, create device recipes, and work with equipment and vendors to resolve issues. This role requires adaptability to a fast-paced environment and the ability to work 12-hour rotating shifts.

Qualifications

• Diploma or Degree in Electrical & Electronic, Mechanical & Mechatronics, Physics Engineering or equivalent.
• 2 years of relevant experience in Die Pick & Place, Package Pick & Place or Tape & Reel.

Responsibilities

• Perform production line sustaining to ensure processes run with quality.
• Follow up on process improvement projects assigned by Process Engineer.
• Characterize new devices and create recipes in the machine.
• Respond promptly to investigate and analyze products with problems.
• Collaborate with line supervisor to clear real-time bottlenecks affecting cycle time and quality.
• Support other engineers to clear equipment downtime and resolve issues.

Skills

Die Pick & Place experience

Packaging process knowledge

Education

Diploma or Degree in Electrical & Electronic / Mechanical & Mechatronics / Physics Engineering

Job description

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a technically skilled Associate Engineer to provide support to Process Engineers in the eWLB Backend2 Department. You will help ensure product quality, productivity, and cost efficiency while sustaining production lines.

You will characterize new devices, create device recipes, and work with equipment and vendors to resolve issues. This role requires adaptability to a fast-paced environment and the ability to work 12-hour rotating shifts.