Semiconductor Process Engineer: Backgrind & Wafer Saw

STATS CHIPPAC MANAGEMENT PTE. LTD.

Singapore

Vor Ort

SGD 56.000 - 78.000

Vollzeit

Vor 4 Tagen

Sei unter den ersten Bewerbenden

Eine vollständige Bewerbung in einer Minute

Maßgeschneiderter Lebenslauf und Anschreiben – versandbereit.

Schaffe es an den ATS-Filtern vorbei

Zusammenfassung

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a qualified engineer to support qualification and engineering builds for pre-assembly and customer builds.

This role covers NPI and plant-wide Qual Engineering, impacting operations from engineering to high-volume production. You will coordinate with Operations, perform customer DOE evaluations, and provide improvement recommendations. A strong SPC mindset and good communication are essential, with willingness to work beyond normal hours when

Qualifikationen

Bachelor's degree in mechanical or electrical engineering.
Experience with Backgrind, Laser Groove and Wafer Saw.
Approximately 3 years in Pre-Assembly.
Strong SPC and problem-solving skills.
Good communication; able to work overtime when needed.

Aufgaben

Coordinates with Operations to ensure that Engineering Builds are processed per requirement.
Perform customer evaluations and DOE & provide recommendation for improvements if necessary.
Ensures smooth transition of new products from Engineering Mode to High Volume Manufacturing.
Provide corrective actions & improvement plans for all issues observed during Engineering & Qualification builds.

Kenntnisse

Backgrind process

Laser Groove process

Wafer Saw process

SPC & Problem Solving

Communication skills

Pre-Assembly experience

Ausbildung

Bachelor’s Degree in Mechanical Engineering or Electrical / Electronics Engineering

Jobbeschreibung