Bonding Wire Process Engineer | Yield & Quality Optimizer

Heraeus Electronics; Singapore; On-site; SGD 55,000 - 90,000; Full time

Job summary

Heraeus Electronics in Singapore is seeking a Process Engineer to sustain and optimize bonding wire manufacturing processes. You will troubleshoot production issues, drive continuous improvement, and support new product introductions while ensuring product quality, yield, and cost competitiveness.

The role requires collaboration with Manufacturing, Maintenance, NPI, and Quality Assurance teams to update documentation and drive efficiency across operations.

Qualifications

• Bachelor degree in engineering or related field is required.
• 2 years of relevant experience preferred.
• Knowledge of semiconductor interconnect and assembly materials is a plus.

Responsibilities

• Lead or participate in metallurgical and materials engineering projects involving bonding wire processes.
• Sustain and control existing manufacturing processes and troubleshoot production issues.
• Drive continuous process improvements, yield, and productivity improvements.
• Support new product introductions and update FMEA, Control Plan, and SOPs.
• Collaborate with cross-functional teams to improve processes and documentation.
• Monitor SPC/SQC metrics and contribute to CAPA and KPI reporting.

Skills

Troubleshooting

Process optimization

Quality improvement

Education

Bachelor of Engineering (Mechanical/Chemical/EEE/Physics)

Tools

SPC

Minitab/JMP

Job description

Heraeus Electronics in Singapore is seeking a Process Engineer to sustain and optimize bonding wire manufacturing processes. You will troubleshoot production issues, drive continuous improvement, and support new product introductions while ensuring product quality, yield, and cost competitiveness.

The role requires collaboration with Manufacturing, Maintenance, NPI, and Quality Assurance teams to update documentation and drive efficiency across operations.